规格参数

Processor	Intel® 3rd Generation Core™ i7/i5/i3 Mobile Processor Onboard  i7-3555LE (2.5GHz, dual-core, 4MB cache, TDP=25W)  i3-3217UE (1.6GHz, dual-core, 3MB cache, TDP=17W)
Chipset	Intel® QM67/HM76
CompactPCI Bus	• PCI 32bit/ 33MHz; 3.3V, 5V universal V I/O • Supports operation in system slot as master or in peripheral
Memory	Onboard DDR3 2GB
Bios	AMI  BIOS-8MB-SPI Flash
Graphics	• Integrated in Intel® Core™ processor • DB-15 VGA port on Rear panel,  resolution up to 2048 x 1536 • HDMI port on Front panel, resolution up to1920 x 1200
Storage  Interface	• One SATA 6Gb/s direct connector for 2.5" onboard HDD/SDD on layer-2 •SATAx3 on J2
Ethernet	• Intel® 82579LMx1 & Realtek RTL-8111Ex1 • Two egress 10/100/1000BASE-T ports switchable to J2 by BIOS setting
Serial Ports	• Up to four serial ports • Two RS-232/422/485 serial port on layer-2 front panel • Additional one RS-232 10-pin header(RS232 3T/5R) on J2 rear panel • Additional RS-232 10-pin header (RS232 1T/1R) on J2 rear panel
USB	• Front panel:USB3.0x2 ,USB2.0x2• Rear panel(J2):USB2.0x3 (one port for USB to UART)
Power Requirement	+12V, AT/ATX
Board Size	100 mm x 160 mm
Operating Temp.	A ：0℃～+60℃  B：-20℃～+70℃
Storage Temp.	-40°F ~ 176°F (-40°C ~ 80°C)
MTBF (Hours)	60,000